Products
Products
AMB ceramic substrate for Power Modules
+
  • AMB ceramic substrate for Power Modules

AMB ceramic substrate for Power Modules

 AMB(Active Metal Brazing Substrate) is the further development of DBC technology. It is a method to use a small amount of active elements such as Ti and Zr contained in the filler metal to react with ceramics to form a reaction layer that can be wetted by liquid solder, so as to realize the bonding between ceramics and metals. AMB is combined by chemical reaction between ceramic and active metal solder at high temperature, so its bonding strength is higher and its reliability is better.

Keyword: AMB ceramic substrate for Power Modules

Description

1.Material:Aluminum Nitride/Alumina/ZTA/Si3N4.

2.Function:Insulation and heat dissipation ceramics.

3.Type:Metallized ceramic.

4.Can be customed:yes,please provide drawings for specific products.

 

Product Details:

AMB ceramic substrate for Power Modules

 

Product Description:

AMB ceramic substrates have higher bonding strength and cold and thermal cycling characteristics and have made progress in applications such as high-power semiconductor modules, high-frequency switches, wind power generation, new energy vehicles, power locomotives, and aerospace.

 

Our Service:

Please contact us for customization. We can also supply Aluminum Nitride (AlN) Ceramic with thermal conductivity up to 230W/mK

 

Specification:

Copper/Ceramic/Copper specification(mm)

AIN-AMB

0.30/0.38/0.30

0.30/0.64/0.30

 

 

Si3N4-AMB

0.25/0.32/0.25

0.30/0.32/0.30

0.80/0.32/0.80

1.20/0.32/1.20

ZTA-AMB

0.30/0.32/0.30

0.40/0.32/0.40

 

 

 

Send Me Inquiry


Note: Please leave your email address, our professionals will contact you as soon as possible!

Action
Submit