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DBC Ceramic Substrate Direct Bond Copper Sheet for IGBT
Keyword: DBC Ceramic Substrate Direct Bond Copper Sheet for IGBT
Description
1. Material: Alumina/ ZTA/ Si3N4
2. Function: Insulating ceramic.
3. Type: Metalized Ceramicc.
4. Can be customed: Yes, please provide drawings of specific products.
Product Details:
DBC Ceramic Substrate Direct Bond Copper Sheet for IGBT
Product Description:
Direct Bonding Copper is a kind of composite line subgrade board that is directly sintered copper foil to ceramic surface by hot-melt bonding method at high temperature, which can withstand high voltage and large current.
DBC ceramic substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of IGBT modules.
Our Service:
Please contact us for customization.
Specification:
| Copper/Ceramic/Copper specification（mm） | ||||||
|
Al2O3-DBC |
0.20/0.38/0.20 |
0.25/0.38/0.25 |
0.3/0.38/0.30 |
0.20/0.64/0.20 |
0.25/0.64/0.25 |
0.30/0.64/0.30 |
|
ZTA-DBC |
0.20/0.32/0.20 |
0.25/0.32/0.25 |
0.30/0.32/0.30 |
|
|
|
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