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DBC Ceramic Substrates for Semiconductor
Keyword: DBC Ceramic Substrates for Semiconductor
Description
1. Material: Alumina/ ZTA/ Si3N4
2. Function: Insulating ceramic.
3. Type: Metalized Ceramicc.
4. Can be customed: Yes, please provide drawings of specific products.
Product Details：
DBC Ceramic Substrates for Semiconductor
Product Description:
DBC is a kind of composite line subgrade board that is directly sintered copper foil to ceramic surface by hot-melt bonding method at high temperature, which can withstand high voltage and large current.
Direct Bond Copper Substrate are used a special process in which the copper foil and the Al2O3 are directly bonded under appropriate high temperature, which applications are power semiconductor modules, thermoelectric cooling modules, electronic heating devices, power control circuits, power hybrid circuit.
Our Service:
Please contact us for customization.
Specification:
| Copper/Ceramic/Copper specification（mm） | ||||||
|
Al2O3-DBC |
0.20/0.38/0.20 |
0.25/0.38/0.25 |
0.3/0.38/0.30 |
0.20/0.64/0.20 |
0.25/0.64/0.25 |
0.30/0.64/0.30 |
|
ZTA-DBC |
0.20/0.32/0.20 |
0.25/0.32/0.25 |
0.30/0.32/0.30 |
|
|
|
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