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Direct Bond Copper DBC Ceramic Substrate for Semiconductor Modules
Keyword: Direct Bond Copper DBC Ceramic Substrate for Semiconductor Modules
Description
1. Material: Alumina/ ZTA/ Si3N4
2. Function: Insulating ceramic.
3. Type: Metalized Ceramicc.
4. Can be customed: Yes, please provide drawings of specific products.
Product Details:
Direct Bond Copper DBC Ceramic Substrate for Semiconductor Modules
Product Description:
Direct Bond Copper substrates signify a process in which ceramic material and copper are bonded together at a high temperature. DBC ceramic substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of high power semiconductor modules.
Increasing applications of power modules in various fields such as industrial, automotive and transportation, and consumer devicces are expected to fuel the expansion of the global market in the coming years.
Our Service:
Please contact us for customization.
Specification：
| Copper/Ceramic/Copper specification（mm） | ||||||
|
Al2O3-DBC |
0.20/0.38/0.20 |
0.25/0.38/0.25 |
0.3/0.38/0.30 |
0.20/0.64/0.20 |
0.25/0.64/0.25 |
0.30/0.64/0.30 |
|
ZTA-DBC |
0.20/0.32/0.20 |
0.25/0.32/0.25 |
0.30/0.32/0.30 |
|
|
|
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