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Active Metal Brazing(AMB) Ceramic Substrate Used for IGBT Modules
Keyword: Active Metal Brazing(AMB) Ceramic Substrate Used for IGBT Modules
Description
1. Material: Aluminum Nitride/ZTA/Si3N4.
2. Function: Insulation and heat dissipation.
3. Type: Metalized Ceramic.
4. Can be customed: Yes, please provide drawings of specific products.
Product Details:
Active Metal Brazing(AMB) Ceramic Substrate Used for IGBT Modules
Product Description:
Active Metal Brazing(AMB) process is a further development of the Direct Bonded Copper(DBC) process technology. It is a method of joining ceramics to metals by using a small amount of active elements contained in the brazing material to react with ceramics to create a reaction layer that can be wetted by the liquid brazing material.
At present, with the rapid development of power electronics technology, high-power device control modules on high-speed rail on the IGBT module packaging of key materials-ceramic copper-clad panels form a huge demand, especially the AMB substrate gradually become mainstream applications.
Our Aluminum Nitride(AlN) substrates are available in various sizes and thicknesses. Thanks to a large and live inventory, we can ship your part fast for you to start your project.
Our Service:
Please contact us for customization.
Specification：
| Copper/Ceramic/Copper specification（mm） | ||||
|
AIN-AMB |
0.30/0.38/0.30 |
0.30/0.64/0.30 |
|
|
|
Si3N4-AMB |
0.25/0.32/0.25 |
0.30/0.32/0.30 |
0.80/0.32/0.80 |
1.20/0.32/1.20 |
|
ZTA-AMB |
0.30/0.32/0.30 |
0.40/0.32/0.40 |
|
|
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